| 학회 |
한국공업화학회 |
| 학술대회 |
2018년 봄 (05/02 ~ 05/04, 대구 엑스코(EXCO)) |
| 권호 |
22권 1호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Study on Curing Property of Mercaptan Hardener for Low-temperature |
| 초록 |
The development of epoxy adhesive with adhesive strength and high performance has led to a manufacturing of industry. The curing process of the epoxy resins can be carried out using a wide range of curing agents, such as amines, anhydrides, polyamides, phenol form aldehyde resins and polysulfides. Especially at low temperatures, the curing reaction of epoxy and mercaptan is faster than the reaction of epoxy and amine. In order to increase the productivity, it is required to epoxy adhesives rapidly cured at a low temperature. The mercaptan oligosiloxane resins were synthesized by sol-gel condensation reaction of (3-mercaptopropyl)-dimethoxysilane (MPDMS), (3-mercaptopropyl)-trimethoxysilane (MPTMS) and diphenylsilanediol (DPSD). The adhesive properties were analyzed by Differential Scanning Calorimetry (DSC), Gel Permeation Chromatography (GPC) and Matrix-Assisted Laser Desorption Ionization – Time of Flight mass spectrometer (MALDI-TOF). |
| 저자 |
강호용, 권세진, 임종태, 석웅철, 강주희, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
curing behavior; mercaptan hardener; epoxy adhesive; low temperature
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| E-Mail |
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