| 초록 |
An integrated circuit board (IC board) is one of the greatest inventions in the electrical industry, and is a crucial component in electrical devices in the current era. Copper clad laminates (CCLs) are key base materials to fabricate IC boards; CCLs consist of a polymeric matrix reinforced with glass fabric and copper layers. Herein, we fabricated siloxane-based polymer materials using peroxide-derived radical polymerization of linear vinyl phenyl-methyl oligosiloxane (LVPO) resin. The siloxane-based polymer material shows low dielectric constant (Dk≈2.75 @ 1GHz) and, especially, low dissipation factor (Df≈0.0013 @ 1GHz) that are maintained in a high frequency range (up to 10GHz) and at high temperature (up to 275oC). The fabricated CCLs by LVPO show superior dielectric and thermal properties compared to the FR-4 laminates, the conventional epoxy laminates for CCLs, along with flame resistance without any addition of flame retardant that have negative health or environmental issues. |
