| 학회 | 한국고분자학회 |
| 학술대회 | 2004년 가을 (10/08 ~ 10/09, 경북대학교) |
| 권호 | 29권 2호, p.594 |
| 발표분야 | 기능성 고분자 |
| 제목 | Adhesion properties between surface modified polyimide film and copper |
| 초록 | The polyimide films are widely used as dielectric materials in microelectronics. The adhesion of the copper to the polyimide film is generally poor. A number of surface modifications, such as wet-chemical treatment, UV excimer irradiation, plasma treatment, and ion beam irradiation have been applied to the polyimide substrates to enhance their adhesion to copper 1-2. In this work, characteristics of copper on the polyimide film with surface modification are investigated. A polyimide film having a wet-chemical treated surface. The polyimide film surface was treated by dipping it into a 3 M potassium hydroxide (KOH) and 3 M ethylene diamine aqueous solution. The surface modified polyimide film was analysed by Fourier transform infrared (FT-IR) spectroscopy. The topography of the modified polyimide surface was investigated by scanning electron microscope (SEM). The peel strength of the electro plating deposited copper to the surface modified polyimide film could reach about 0.6 Kg/cm. Fig. 1. SEM image of surface modified polyimide film; (a) KOH treatment, (b) Ethylene diamine treatment. References 1. Weixing Yu and Tze-Man Ko, European polymer journal 37, 1791 (2001). 2. Wei Chen, Junying Zhang, Qi Fang, Keliang Hu, and Ian W. Boyd, Thin solid films 453, 3 (2004). |
| 저자 | 강휘원1, 강형대1, 김석제1, 이영식2, 이재흥1, 홍영택1 |
| 소속 | 1한국화학(연), 2아텍엔지니어링 |
| 키워드 | adhesion; polyimide; surface |
