| 초록 |
Epoxy resins had excellent properties, durability, electrical insulation. Therefore it is widely used as adhesives and coatings. But using only epoxy resin needed its formulation according to properties of it because of increasing the cost. In this study, the optimal amount of addition was determined by assessing thermal stability according to silica size and amount rate for the appropriate production of mold. Thermal Stability measured x, y, z axial - thermal deformation ratio and volume deformation ratio. curing process of specimens (Epoxy resin, DGEBA type YD-128) used poly amide hardener and added 50wt% SiO2, reactive diluents or nonreactive diluents with curing process at 70℃, 70min. |
