| 학회 | 한국공업화학회 |
| 학술대회 | 2019년 가을 (10/30 ~ 11/01, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 | 23권 2호 |
| 발표분야 | 포스터_고분자 |
| 제목 | Development of through-plane thermal conducting pathway via using of hybrid Al2O3/h-BN fillers in polymer composites |
| 초록 | Heat dissipation polymer composites consists of polymer with high thermal conductivity filler such as carbon or ceramic (Al2O3, AlN, h-BN) material. One of the ceramic materials, h-BN is a promising filler material because of high thermal conductivity with insulate property. however in thermal interface materials and gap filler application, it is hard to apply as a filler because of its anisotropic thermal conductivity (∥: 600 W/mK, ⊥: 30 W/mK). In this study, in order to fabricate 3-dimensional thermal path and optimize through-plane thermal conductivity, composites were prepared using spherical Al2O3 and h-BN based on silicone rubber. structure of composite is designed to surround the Al2O3 of h-BN in order to dissipate heat well in vertical direction, and optimized thermal conductivity is obtained by controlling the content of Al2O3 and h-BN. |
| 저자 | 임민섭, 류승한, 좌용호 |
| 소속 | 한양대 |
| 키워드 | Thermal interface materials(TIMs); Composite; Thermal conductivity |
