| 학회 |
한국공업화학회 |
| 학술대회 |
2016년 봄 (05/02 ~ 05/04, 여수 엑스포 컨벤션) |
| 권호 |
20권 1호 |
| 발표분야 |
고분자_포스터 |
| 제목 |
Silane treated h-BN for improved thermal conductive epoxy composite for Thermal interface materials (TIMs). |
| 초록 |
To improve the thermal conductivity of h-BN-filled epoxy composite, silane treatment was used to 3-Aminopropyltriethoxysilane(APTES) on the h-BN surface to improve the interfacial adhesion in the composite. An efficient approach was developed to functionalize h-BN with 3-Aminopropyltriethoxysilane (APTES) by wet solution method. The exfoliated h-BN was first treated with molar solutions of H2SO4/HNO3 to attach the epoxide groups on the surface of h-BN. The functionalization was confirmed by Fourier transformed infrared spectroscopy. The FT-IR peaks obtained at 1021cm-1, 1110cm-1 about Si-O-Si peaks and 3412cm-1 about -NH peak. Furthermore, the introduction of APTES treated h-BN in epoxy matrix significantly enhanced the thermal conductivity at high volume fraction. The in-plane thermal conductivity at high fraction of h-BN (10 vol. %) was improved up to 2.98 W/m.K, which was ~15 times higher than that of controlled epoxy (0.2 W/m.K). |
| 저자 |
김형근1, 김종석2, 이윤선3, 양철민3, 김윤섭1, 무와마드와심2
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| 소속 |
1전남대, 2전북대, 3한국과학기술(연) |
| 키워드 |
열전도도; 복합재료; 실란커플링; 육방정질화붕소; h-BN
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| E-Mail |
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