| 초록 |
Nickel thin film with uniform and highly dense microstructure on the copper plate was prepared by the electroplating method in a Watt plating bath. The experiment was carried out with an increasing temperature from 20 °C to 60 °C and current density from 1 A/dm2 to 10 A/dm2. The property of electroplated nickel film was evaluated by a crystal structure, surface roughness, and hardness. By measuring the amount of Ni2+ consumed through the plating, it was shown the relationship between used Ni2+ amount and plated thickness. |
