| 학회 | 한국재료학회 |
| 학술대회 | 2008년 봄 (05/22 ~ 05/23, 상록리조트) |
| 권호 | 14권 1호 |
| 발표분야 | 전자재료 |
| 제목 | Effect of The Plasma Treatment on Embedded PCB Reliability |
| 초록 | Interface delamination is recognized as one of the major failure of microelectronics packaging. It can result from various factors, including stress from mismatch of adherent materials, thermal stress from the difference of CTE and interface material adhesion strength. This paper focuses on the evaluation of plasma process on Die Embedding, including resistance to interface delamination. Plasma Treatment of surfaces should provide better mechanical strength and contact resistance. The optimized plasma process parameters are obtained by surface contact angle measurements. The plasma treatment results are also verified by scanning electron microscopy (SEM) as well as physical pull and shear tests. |
| 저자 | 정형미, 신이나, 이정원, 정율교 |
| 소속 | 삼성전기 |
| 키워드 | Plasma; interface |
