| 초록 |
In this work, the physicochemical characteristics of polyimide-modified epoxy resins were studied. polyimides were prepared from the dianhydride and the diamine in two step. A hot-melt processable thermosets were prepared by tetra-functional epoxy resins and a high-Tg, low-K thermoplastic polyimide. Thermal properties of the resins were characterized by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and dynamic mechanical analyzer (DMA). Also, rheological behavies of the resins were studied using a rheometer. Mechanical and dielectrical properties of cured films were investigated with tensile and dielectrical spectrometry, respectly. From the result, only one glass transition temperature (Tg) was detected by DMA, showing full miscibility between the blend components. |
