| 학회 |
한국고분자학회 |
| 학술대회 |
2009년 봄 (04/09 ~ 04/10, 대전컨벤션센터) |
| 권호 |
34권 1호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Preparation and Characterization of Thermally Conductive Adhesives UV-Photopolymerization |
| 초록 |
Thermally conductive pressure sensitive adhesives (TC-PSA) are a kind of thermal interface materials which were used to fill the gaps between thermal transfer surfaces increase thermal transfer efficiency. TC-PSA was prepared by adding filler particles before and after photo-polymerization. The effect of filler (Carbon fiber or Al2O3) particles such as, their shape, contents and thermal conductivity and adhesion properties of TC-PSAs were investigated. |
| 저자 |
박꽃피네, 김혜민, 임승원, 김성룡
|
| 소속 |
충주대 |
| 키워드 |
pressuer sensitive adhesives; thermal conductivity; photopolymerization
|
| E-Mail |
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