| 초록 |
Isotropical conductive adhesives (ICAs) are the composites of polymer resin and conductive fillers. While ICAs have been studied extensively to replace the eutectic Sn/Pb solder in various electronic product interconnects, there are limitations of these materials. Main limitations of ICAs such as unstable contact resistance and poor mechanical strength in various environmental conditions are major obstacles which are preventing ICAs from becoming a general replacement for solders in electronic applications. In this study, the silver nanoparticles could be replaced with a few micron-sized silica particles. Since silica is generally employed to control the rheological properties of the composites to improve their processability and mechanical properties. This study showed the effect of silica concentration on the electrical and mechanical properties of epoxy/silver nanoparticles adhesives. These nanocomposites were characterized by SEM, TGA, TMA and four-point probe measurement. |
