| 초록 |
Flexible Printed Circuit Board (FPCB) is composed of copper/adhesive/polyimide film layers. Generally, acrylic polymer is used to adhesive layer. But it has a problem that occurs to curling phenomenon, because acrylic polymer has a different CTE (Coefficient of Thermal Expansion) between PI or copper and adhesive layer. Therefore, we prepared a PAA adhesive which has similar or same structure to PI layer. In this study, the PI adhesive was prepared from polyamic acid through thermal imidization and added some filler. As content of added filler, surface properties of adhesive layer on PI film layer and copper layer were investigated. Its surface morphology and tension were investigated by using SEM, AFM, contact angle, etc. The relations of interface among polyimide or copper and adhesive layer were affected by dispersity and property of filler particles. So, we'll discuss relationships of base resin and property of filler according to hydrophobic and hydrophilic moiety in FPCB. |
