| 초록 |
The effect of pretreatment of TiN surface for silver electroless deposition with ammonia complexing agent and cobalt as reducing agent was investigated. Ag activated following Sn sensitized surface, which catalytic particles are deposited by adsorption of colloidal Sn particles, showed low resistivity and smooth surface morphology. But on Ag and Pd activated surfaces which catalytic particles are deposited by displacement reaction of metal ions, deposited silver film had many voids and higher resistivity. It was because of low density of growing site during silver deposition on Ag activated and Pd activated surfaces. To find the reason of decreased density of growing site, investigation of initial stage of electroless deposition on activated surface was performed by FE-SEM. In initial stage of silver deposition on Pd activated surface, only few of deposited catalytic particles initiated silver deposition reaction, and many Pd particles didn’t participate in deposition process. In contrast, growing silver particle coalesced and growing site density was decreased during deposition process in case of Ag activated surface. |
