| 학회 |
한국공업화학회 |
| 학술대회 |
2021년 봄 (05/12 ~ 05/14, 부산 벡스코(BEXCO)) |
| 권호 |
25권 1호 |
| 발표분야 |
포스터-디스플레이 |
| 제목 |
Heat Peeling Behavior of Acrylic Pressure Sensitive Adhesives using Hydrogen Bonding and Improvement of Heat Peeling Properties by Introduction of h-BN Particle |
| 초록 |
Recently, PSAs with a level of adhesion similar to that of adhesive have been developed, but this causes a problem in which it is difficult to peel the PSAs from the substrate. To solve this problem, various methods have been proposed to control the peeling characteristics of PSAs through stimulation, such as heat, UV irradiation etc. However, these studies have the disadvantage of damaging the substrate because high temperatures above 100 °C or very strong UV must be applied for a long time to decompose the backbone and side-chain of PSAs. In this study, acrylic PSAs that can be peeled off in a short time at high temperature were designed using 2-hydroxyethyl acrylate (HEA). Heat peeling properties were controlled through the content of HEA. Moreover, h-BN particles were introduced to improve the thermal diffusion characteristics of the adhesive, and the effect of h-BN particles on the thermal peeling behavior was analyzed. |
| 저자 |
석웅철, 박준형, 임종태, 서민혜, 강주희, 이상국, 송호준
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| 소속 |
한국생산기술(연) |
| 키워드 |
Heat-peeling; acrylic PSAs; boron nitride
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| E-Mail |
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