The adhesion of films and coatings is often measured by determining the load required to separate them from their substrate. If there are residual stresses that are relaxed upon delamination, then an additional contribution to the energy-release rate will affect the measurements. These residual stresses may also cause a shift in the mode-mixedness of the interface crack which, in tum, can affect the interfacial toughness. To ensure an accurate interpretation of adhesion measurements, therefore, the effects of these stresses must be considered. These effects are discussed with particular reference to two commonly used test geometries: the blister test and the peel test.