This study is concerned with the thermal stress analysis of an adhesive butt joint which contains circular holes and rigid fillers in an adhesive and is under a non-uniform temperature field In the analysis, the adherends are assumed to be rigid and the adhesive is replaced with a finite strip having holes and rigid fillers in it and the thermal stress distribution in the adhesive is analyzed using a two-dimensional theory of elasticity. The effects of size and location of the circular holes and rigid fillers on the stress distributions at the interface and at the hole and filler peripheries are clarified by numerical calculations. For verification, photoelastic experiments were performed using an epoxide resin plate with small holes and fillers in it, to model and adhesive in the joint. The analytical results are fairly consistent with the experimental ones.