The observation of crystal growth on a microscopic level is important to fields from metallurgy to cryobiology. The thermal behavior of a cryomicroscope stage has been analyzed by accounting for the spreading of heat and the thermal contact resistance between the solidification stage and the constant temperature plates. A scale analysis has been developed and a numerical solution has been obtained, and the results are presented and discussed. Temperature measurements have been used to estimate the thermal contact conductance. The results show that, although the thermal contact resistance cannot be ignored, the temperature gradient in the region of interest is uniform. Accounting for the thermal contact resistance and for the heat spreading is necessary to predict the order of magnitude of the temperature gradient over the metallic slide.