The ultraviolet (UV) curable epoxy siloxane polymer is shown to cross-link at low UV dosages of 130 mJ/cm(2), making it desirable for use in nanoimprinting and the rapid fabrication of micro/nano-scaled patterns. In this paper, the dielectric and mechanical properties of this UV-cured epoxy siloxane polymer are investigated. The results of these tests show that the rapid UV-cured polymer films have a dielectric constant of 2.7 +/- 0.13, leakage current density on the order of 10(-9) A/cm(2) under 1 MV/cm, dielectric strength of greater than 5 MV/cm, and a reduced modulus of elasticity of 6.2 GPa characterized using nanoindentation. These properties indicate that the epoxy siloxane can be used to fabricate layers for functional device applications. (C) 2011 Elsevier B.V. All rights reserved.