A new flat miniature heat pipe configuration for application to cooling electronic components is proposed for high heat fluxes (over 100 W cm(-2)) on the evaporator wail. The heat pipe contains the inverted meniscus type evaporator and axial capillary grooves covered with a porous plate for the liquid transport. Numerical results for the capillary limit and maximum heat flux, which has been calculated with respect to the formation of the vapor blanket in the porous structure of the evaporator, are presented for a copper-water miniature heat pipe with the external dimensions 2 x 7 x 120 mm.