화학공학소재연구정보센터
Journal of Materials Science, Vol.47, No.9, 4012-4018, 2012
Suppressing the growth of interfacial Cu-Sn intermetallic compounds in the Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joint during thermal aging
Evolution of interfacial phase formation in Sn-3.0 Ag-0.5Cu/Cu (wt%), Sn-3.0Ag-0.5Cu-0.1Ni/Cu, Sn-3.0 Ag-0.5Cu/Cu-15Zn, and Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joints are investigated. Doping Ni in the solder joint can suppress the growth of Cu3Sn and alter the morphology of the interfacial intermetallic compounds (IMCs), however it shows rapid growth of (Cu,Ni)(6)Sn-5 at the Sn-3.0Ag-0.5Cu-0.1Ni/Cu interface. In comparison with the Cu substrates, the Cu-Zn substrates effectively suppress the formation of Cu-Sn IMCs. Among these four solder joints, the Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joint exhibits the thinnest IMC, and only (Cu,Ni)(6)(Sn,Zn)(5) formed at the interface after aging. It is revealed that the presence of Ni acts to enhance the effect of Zn on the suppression of Cu-Sn IMCs in the SAC305-0.1Ni/Cu-15Zn solder joint. The limited formation of IMCs is related to the elemental redistribution at the joint interfaces during aging. The Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn joint can act as a stabilized interconnection due to the effective suppression of interfacial reaction.