Removal of Ta films has been investigated in solutions containing 2,5 dihydroxy benzene sulfonic acid and potassium iodate (KIO3) under conditions that exist during electrochemical mechanical polishing. Specifically, the films were abraded at low pressures (similar to 0.5 psi) on a polyurethane pad under galvanostatic conditions. Variables such as pH, KIO3 concentration, and current density have been investigated to develop an optimized formulation. The nature of the oxide film formed on tantalum during the electrochemical abrasion process was investigated using x-ray photoelectron spectroscopy and nanoindentation techniques. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3535269] All rights reserved.