A zinc-metal dopant-oxygen precursor exposure cycle is demonstrated as a modified deposition procedure for better distribution of Al-dopants in ZnO films by atomic layer deposition with the aim to reduce the formation of nanolaminate thin films that might form with the typically used alternating ZnO and metal oxide deposition procedure. The distribution and chemical bonding states of Al-dopants were studied with various dopant deposition intervals of Zn-Al-O precursor and Zn-O cycles at 1::4, 1::9, 1::14, and 1::19 ratios. The smallest resistivity of Al-doped ZnO film without degradation of transparency was obtained at 250 degrees C with 5.37 x 10(-4) Omega cm. (C) 2010 American Vacuum Society. [DOI: 10.1116/1.3460905]