A novel metallization of non-conductive epoxy substrate with Cu-Sn "speculum alloy,"or" white bronze," was performed through successive electrochemical processes: (i) conventional electroless deposition of pure Cu layer and (ii) subsequent electrochemical alloying of the resulting pure Cu layer with Sn using an ionic liquid bath at 150 degrees C, a medium-low temperature. Availability of the Sn quasi-reference electrode for the alloying was verified, and the resulting compact and adhesive Cu-Sn layers, composed of Cu6Sn5 and/or Cu3Sn intermetallic phases, were examined as an alternative to nickel plating. The abundance of the two intermetallic phases was found to be dependent on the alloying potential and duration, and was discussed in terms of alloy formation thermodynamics of the Cu-Sn system. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3573984] All rights reserved.