화학공학소재연구정보센터
Journal of the Electrochemical Society, Vol.157, No.10, C338-C345, 2010
Kinetics of Corrosion Film Growth on Copper in Neutral Chloride Solutions Containing Small Concentrations of Sulfide
The corrosion behavior of oxygen-free copper in an anoxic 0.1 M NaCl + 5 x 10(-4) M Na2S solution was studied using electrochemical impedance spectroscopy, scanning electron microscopy equipped with a focused ion beam, X-ray photoelectron spectroscopy and micro X-ray diffraction. The corrosion film grew as a coherent, compact crystalline layer with a nonuniform thickness. The growth kinetics obeyed a parabolic law consistent with control by a diffusion process. Once a coherent layer was established, film growth kinetics appeared to be controlled by Cu+ ion diffusion through the film. At shorter times before a coherent film was established, SH- diffusion in solution exhibited a considerable influence on the growth rate. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3478570] All rights reserved. 2