A new method has been developed for the superhydrophilic surface modification of copper using versatile solution-based fabrication techniques. The high surface area of TiO2 nanoparticles was exploited to create a thin film with increased surface energy that transformed copper materials from relatively hydrophobic to superhydrophilic. Copper exposed to ambient conditions resulting in a thin layer of copper oxide has a water contact angle near 90 degrees, but following TiO2 modification, the contact angle dropped to 0 degrees. The thin film responsible for this drastic improvement in wettability proved durable by retaining its excellent properties throughout an extended application of thermal stress. SEM and Raman Spectroscopic analysis confirmed the structural integrity of the film before and after a durability test. (C) 2010 Elsevier Inc. All rights reserved.