화학공학소재연구정보센터
Composite Interfaces, Vol.17, No.8, 789-801, 2010
Nano-indentation Test and Numerical Evaluation of Cu-Cr Interface Structure in Micro/Nano Manufacturing
Interface design is an important topic in micro/nano electronic manufacturing. Interfaces of dissimilar materials in micro/nano electronic manufacturing are prone to crack initiations, leading to delaminations. The objective of this paper is to provide a systematic investigation to design or evaluate a bilayer film structure between Cu and Cr in micro/nano electronic manufacturing. In this paper, the Cu/Cr bilayer film prototype was deposited on the quartz glass by using RF magnetron sputtering. The elastic modulus and the hardness of the bilayer film prototype can be tested by using a nano-indenter. The test results show that the elastic modulus and the hardness of the bilayer film prototype are different at the difference maximum depth, h(max). The elastic modulus and the hardness of the Cu/Cr interface are influenced by the nanometer indentation size effect and each single film. The elastic modulus of the bilayer film shows nonlinear characteristics which include increase at first and decrease on second stage. The change trend of the hardness also shows nonlinear characteristics which include a fast steady decline at first and a slow nonlinear decline on second stage. These results show that there are scale domino effects in micro/nano electronic manufacturing. Based on the test results, the mechanical properties of the interface are not the simple average of each composition film. There is very great difference in the interface. In the meantime, the finite element method is used to simulate the plastic property of the interface. The comparison between the simulation and the test shows that the modeling method is a valid investigating method to analyze mechanical properties for nano-interface structure. It builds a basis for a progressive study of the mechanical properties of a Cu/Cr interface structure. (C) Koninklijke Brill NV, Leiden, 2010