We report that UV-crosslinked polystyrene (PS) thin films can be used as an inexpensive wet chemical etch resist to create microstructures on silicon wafers. When spin-coated PS films were irradiated, the polymer undergoes UV-induced crosslinking. Patterned PS films were successfully used as the protective layer withstanding chemical etching with the buffered HF solution. Removal of the polymer films by sonicating in water generated microstructures in silicon wafers. This simple and environmentally friendly procedure employs inexpensive commodity polymer and eliminates the use of organic solvents and harsh conditions in the subsequent development process. POLYM. ENG. SCI., 49:945-948, 2009. (C) 2009 Society of Plastics Engineers