Current development of copper electroplating additives. has led to the development of suppressors that not only allow for proper bottom-up fill but also that wet the surface properly for defect-free entry of the copper-seeded wafer into the plating bath. The current work analyzes the adsorption and desorption characteristics of a common block copolymer wetting agent using an electrochemical flow-through cell. Adsorption characteristics are similar to that of polyethylene glycol (PEG) during electroplating, where the adsorption process becomes a strong function of polymer bulk concentration under 200 ppm and where increasing applied potential or current causes the surface suppression of the polymer to decrease. Desorption experiments showed similar results to PEG as well. where a two-stage desorption is seen when the applied potential or current becomes large enough. Computation fluid dynamic modeling of the flow-through cell allowed for the determination of the saturated surface coverage at -0.1 V vs Ag/AgCl, which was 0.041 mu g/cm(2). Additionally. the adsorption rate constant was modeled to be 6.02, 2.045, and 1.22 x 10(5) m(3)/kmol s for applied potentials of -0.1, -0.15. and -0.2 V vs Ag/AgCl, assuming, a constant saturated surface coverage of 0.041 mu g/cm(2). (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3058600] All rights reserved.