The electrodeposition of noble metals, i.e., platinum, palladium, and gold, into macroporous p-type silicon was examined. For platinum and palladium, the electrodeposition proceeded preferentially from the pore bottom to the opening when sodium chloride was used as a supporting electrolyte. When sodium sulfate was used as a supporting electrolyte, the electrodeposition mainly proceeded at pore openings, leading to plugging. For gold electrodeposition, a condition for achieving pore filling from the bottom was not found in either the NaCl or Na2SO4 solutions. Pore depth was another key factor to achieve continuous filling by electrodeposition. As the depth of pores became deeper, the electrodeposition proceeded preferentially from the bottom. The effect of mass transfer in pores was also investigated by changing the concentration of metal ions and applied potential. (c) 2008 The Electrochemical Society.