Slip is well known to take place in micrometer- and nanometer-scale flows. In this study, slip and wall adhesion effects on the imprinting pressure of thermal nanoimprint lithography (NIL) were investigated using computational fluid dynamics. The influence of the mold pattern shape on the imprinting pressure was also analyzed. In thermal NIL, the importance of time in the filling process is relatively high. Reducing the imprinting pressure induces process speed increases, raising productivity a little. Full-slip and no-slip conditions were compared, and various contact angles were applied to survey the influence of the slip condition and wall adhesion, respectively. The full-slip cases required imprinting pressures less than the half values of the no-slip cases. The minimum imprinting pressure was required when the contact angle between the mold and polymer resist was 120. It was confirmed that the residual thickness decreased as the amount of slip increased, leading to a diminution in the postprocessing time. (C) 2009 American Vacuum Society. [DOI: 10.1116/1.3089324]