Dynamic mechanical analysis, thermogravimetric analysis, and dielectric analysis (DEA) were conducted for three thermoset resin systems: bismaleimide, epoxy, and vinyl ester. The resin samples were subjected to various degrees of thermal exposure (400, 270, and 330 degrees C for 5-150 min). Dielectric constants were measured along with the thermomechanical properties. The glass-transition temperature, modulus, and weight loss were important parameters for correlating the material property changes with the heat exposure. A linear relation was determined between the thermomechanical properties and the dielectric properties of the resins under the selected exposure conditions. Therefore, DEA can be introduced as a significant technique for evaluating thermally exposed polymer materials. Interestingly, it is a nondestructive evaluation process. In the future, it could be used for onsite health monitoring of thermally exposed polymer matrix composite structures. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 114: 1417-1425, 2009