We fabricated Ge-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) by using replacement gate process and selective epitaxial growth. In our method, thin Ge layers were selectively grown on the channel region of MOSFETs after the removal of a sacrificial gate stack structure and the etching of the channel region. Ge layers with a smooth surface and a goodmorphology could be obtained by using the thin Si0.5Ge0.5 buffer layer. Dislocations were observed in the epitaxial layers and near the interface between the epitaxial layer and the substrates. We consider that these dislocations degrade the device performance. Although the electrical characteristics of the obtained MOSFETs need further improvement, our method is one of the promising candidates for the practical fabrication process of Ge-channel MOSFETs. (C) 2008 Elsevier B. V. All rights reserved.