An attempt was made to electrodeposit copper on a nanosize atomic force microscopy (AFM) tip by varying the magnitude of current densities with plating time and vice versa. Changes in the current density and plating time resulted in significant changes in the morphology of copper deposits on the AFM probe containing the tip. Scanning electron microscopy (SEM) results revealed that a nonuniform layer of copper was formed on the open areas surrounding the tip; however, no copper deposition was observed on the AFM tip in the absence of photoresist poly(methyl methacrylate) (PMMA). The electron-beam lithography technique proved to be a versatile tool for the electrodeposition of copper on the AFM tip in the presence of photoresist PMMA. Copper was electrochemically deposited on the e-beam modified regions of the AFM probe at a current density of 0.6 A/dm(2) with plating times ranging from 300 to 2400 s. (c) 2008 The Electrochemical Society.