The Dynamic Chemical Plating (DCP) technique allows production of 2-mu m copper films containing particles of graphite or PTFE in 18 and 15 min, respectively, at ambient temperature. DCP yields composites with particle-incorporation fractions of 12% for graphite micro-particles and 22% for PTFE nano-particles. The composite films show excellent tribological properties, acting as self-lubricating coatings with friction coefficients as low as 0.18.