Siloxane을 포함한 ETSO-DDM/BPH계 에폭시 시스템의 경화동력학 및 기계적 특성 분석

김효미; 김종민; 한중근; 김주헌; Hyo-Mi Kim; Jong-Min Kim; Jung-Geun Han; Joo-Heon Kim

Polymer(Korea), Vol.33, No.4, 364-370, July, 2009

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Siloxane을 포함한 ETSO-DDM/BPH계 에폭시 시스템의 경화동력학 및 기계적 특성 분석

Curing Kinetics and Mechanical Properties for Siloxane Contained ETSO-DDM/BPH Epoxy System

김효미, 김종민¹, 한중근², 김주헌 ^†

중앙대학교 화학신소재 공학부
¹중앙대학교 기계공학부
²중앙대학교 건설환경공학부

Hyo-Mi Kim, Jong-Min Kim¹, Jung-Geun Han², and Joo-Heon Kim^†

School of Chemical Engineering & Material Science, Chung-Ang University, Seoul 156-756, Korea
¹School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Korea
²Department of Civil Engineering, Chung-Ang University, Seoul 156-756, Korea

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초록

본 연구에서는 ETSO-DDM(epoxy terminated siloxane-diaminodiphenylmethane) 복합 경화제상 siloxane 함량 변화에 따른 bisphenol계 레진(BPH)과의 경화 특성 변화와 이에 따른 기계적 특성 변화를 고찰해 보았다. ETSO-DDM/BPH 복합재료의 경화 특성 변화는 DSC를 통해 관찰하였으며, 만능 물성기의 인장 시험과 굴곡 시험을 통해 기계적 특성 변화를 측정하였다. ETSO-DDM/BPH 시스템의 경화 활성화 에너지는 ETSO의 함량이 감소함에 따라 지속적으로 증가하는 경향을 보였다. 이는 ETSO 함량이 감소함에 따라 합성된 ETSO-DDM 공단량체의 사슬길이가 짧아지게 되고 이로 인해 ETSO-DDM/BPH간의 가교거리 역시 짧아지게 되어 결국 가교밀도를 증가시켰기 때문으로 판단된다. ETSO 함량이 감소할수록 인장강도, 인장탄성률, 굴곡강도 및 굴곡탄성률 등의 기계적특성은 증가를 보이는데 이는 짧은 사슬길이의 ETSO-DDM 공단량체가 rigid한 구조를 형성하여 공간상 존재하는 분자구조의 에너지 상태가 최소가 되도록 packing하였기 때문으로 사료된다.

The curing kinetics and mechanical properties of siloxane-diaminodiphenylmethane (ETSODDM) on the two kinds of bisphenol (BPH) system which are DGEBA and DGEBF were investigated with the different contents of ETSO. To investigate the curing kinetics of the ETSO-DDM/BPH systems, differential scanning calorimeter (DSC) was used. The mechanical properties of ETSO-DDM/BPH systems were also examined by universal testing machine (UTM), tensile test and flexural test. From experimental results, the activation energies and mechanical properties of ETSO-DDM/BPH were improved with the decrease contents of ETSO. This was due to the high cross-linking density made from short length of ETSO-DDM, resulting in improving the mechanical inter-locking between ETSO-DDM and BPH in these systems.

Keywords:epoxy terminated siloxane;epoxy resin;mechanical property;curing behaviors.

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[Related Articles]

[1] Bauer RS, Epoxy resins chemistry, American Chemical Society, Washington D.C. (1979)

[2] May CA, Epoxy Resins, Marcel Pekker, New York (1988)

[3] Tripathi G, Srivastava D, Material Science and Engineering A, 443, 262 (2007)

[4] Chikhi N, Fellahi S, Bakar M, Eur. Polym. J., 38, 251 (2002)

[5] Park SJ, Kim TJ, Lee JR, J. Korean Ind. Eng. Chem., 10, 7 (1999)

[6] Matsukawa K, Hasegawa K, Inoue H, Fukuda A, Arita Y, J. Polym. Sci. Polym. Chem., 30, 2045 (1992)

[7] Summers JD, Arnold CA, Bott RH, Taylor LT, Ward TC, McGrath J, SAMPE Symp., 32, 613 (1987)

[8] Tesoro GC, Rajendran GP, Uhlmann DR, Park CE, Ind. Eng. Chem. Res., 26, 1672 (1987)

[9] Rozenberg BA, Adv. in Polym. Sci., 75, 113 (1985)

[10] Gonazalez-Romero VM, Casillas N, ANTEC, 87, 1119 (1987)

[11] Girard Reydet E, Riccardi CC, Sautereau H, Pascault JP, Macromolecules, 28, 23 (1995)

[12] Shim JS, Jung HS, Jang JS, J. Korean Ind. Eng. Chem., 1, 2 (1990)

[13] Maeng KS, Kim KS, Shin DK, Kim YC, Polymer(Korea), 14, 2 (1990)

[14] Myung IH, Lee JL, J. Kor. Soc. for Com. Mat., 18, 4 (2005)

[15] Kissinger HE, Anal. Chem., 29, 1702 (1957)

[16] Ozawa T, Bull. Chem. Soc. Jpn, 38, 1881 (1965)

[17] Hatakeyama T, Liu Z, Editors, Handbook of Thermal Analysis, John Wiley&Sons, New York (1998)

[18] Kim MS, Oh SC, Lee HP, Kim HT, Yoo KO, J. Korean Ind. Eng. Chem., 10, 4 (1999)