날개형 핀-휜의 기하학적 형상이 전자기기 모듈 냉각용 공기냉각기의 유동 및 열전달에 미치는 영향

김수연; 허견; 신석원; Soo-Youn Kim; Kyeon Heo; Seok-Won Shin

Clean Technology, Vol.14, No.4, 265-270, December, 2008

Numerical Analysis of Heat Transfer of Aligned Wing Type Pin-Fin Array of Air Cooling Module with Various Fin Shapes for Electronic Packaging Application

김수연^†, 허견¹, 신석원

영남대학교 공과대학 기계공학부, 712-749 경북 경산시 대동 214-1
¹에너지관리공단, 706-722 대구광역시 수성구 범어2동 45-5

Soo-Youn Kim^†, Kyeon Heo¹, and Seok-Won Shin

School of Mechanical Engineering, Yeungnam University, 214-1 Dae-dong, Ciyeongsan, Gyeongbuk 712-749, Korea
¹Korea Energy Manzgement Corporation, 45-5 Beomeo-2-dong, Suseong-gu, Daegu 706-722, Korea

E-mail:

초록

본 연구는 전자기기 모듈의 공기 냉각용 정렬 배열된 핀-휜 열교환기에서 휜 형상의 변화가 유동 및 열전달에 미치는 영향을 수치적으로 해석하였다. 휜 단면의 기하학적 형상은 세 가지로서 원형, 타원형, 그리고 날개형이었다. 취급된 모든 휜의 단면적과 높이는 서로 동일하지만, 그 표면적만은 서로 달랐다. 그 결과, 휜의 표면적, 열전달계수, 그리고 열전달 성능은 휜의 형상에 크게 의존하였다. 적절한 형상을 갖는 휜의 열전달 성능은 세 가지 형태의 핀-휜 중에서 날개형 핀-휜이 가장 우수하였다. 이러한 결과로부터 공기의 유량증가측은 휜의 밀도증가 없이 적절한 핀-휜의 형상변화만으로도 핀-휜 열교환기의 냉각성능을 크게 향상 시킬 수 있음을 알 수 있었다.

In this study, the flow and heat transfer of the aligned pin-fin array of the air cooling module for electronic packaging application were numerically analyzed with various fin shapes. The geometric cross-sectional shapes of pin-fins considered in this study were ellipse, wing and circle. The fins had same cross-sectional area and height, but they had different surface areas. As the results, the surface area, the heat transfer coefficient, and the heat transfer performance of pin-fins greatly depended on their shapes. Of the three types of pin-fins, the wing type pin-fin with suitable shape produced the best heat transfer performance. This result implies that the cooling capacity of the pin-fin cooler can be significantly enhanced only by the change of fin shape without increasing air flow-rate or fin density.

Keywords:공랭;휜 형상;열전달;날개형 휜;Air cooling;Fin shape;Heat transfer;Wing type fin

[References]

Sathe S, Sammakia B, Trans. ASME J. of Heat Transfer, 120, 830 (1998)
Bar-Cohen A, "Air-Cooled Heat Sink-Trends and Future Directions," Proc. Advances in Electronic Packaging, Vol. 2, 1827-1828 (1997)
Kim YH, Rhee GH, Trans. SAREK, 15, 860 (2003)
Razelos P, Satyaprakash BR, Trams. ASME J. of Heat Tramfer, 115, 461 (1993)
Nakazato N, Hirasawa S, Mato T, 'Natural Convection Cooling in Vertical Finned Plates in a Cabinet for Communication Equipment," IEICE Trans. on Electronics, Vol. E81-C, No. 3, 421-426 (1998)
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Fluent, FLUENT 6 User's Guide, Fluent Inc. (2001)

[1] Sathe S, Sammakia B, Trans. ASME J. of Heat Transfer, 120, 830 (1998)

[2] Bar-Cohen A, "Air-Cooled Heat Sink-Trends and Future Directions," Proc. Advances in Electronic Packaging, Vol. 2, 1827-1828 (1997)

[3] Kim YH, Rhee GH, Trans. SAREK, 15, 860 (2003)

[4] Razelos P, Satyaprakash BR, Trams. ASME J. of Heat Tramfer, 115, 461 (1993)

[5] Nakazato N, Hirasawa S, Mato T, 'Natural Convection Cooling in Vertical Finned Plates in a Cabinet for Communication Equipment," IEICE Trans. on Electronics, Vol. E81-C, No. 3, 421-426 (1998)

[6] Morrison AT, "Optimization of Heat Sink Fin Geometries for Heat Sink in Natural Convection," Proc. of the Intersociety Conference on Thermal and Thermo Mechanical Phenomena in Electro Systems, 145-148 (1992)

[7] Fluent, FLUENT 6 User's Guide, Fluent Inc. (2001)