Preparation of super-hydrophilic amorphous titanium dioxide thin film via PECVD process and its application to dehumidifying heat exchangers

Young-Man Jeong; Jae-Keun Lee; Hyun-Woo Jun; Gyu-rak Kim; Youngson Choe

Journal of Industrial and Engineering Chemistry, Vol.15, No.2, 202-206, March, 2009

DOI10.1016/j.jiec.2008.09.013 Export Citation

Preparation of super-hydrophilic amorphous titanium dioxide thin film via PECVD process and its application to dehumidifying heat exchangers

Young-Man Jeong, Jae-Keun Lee, Hyun-Woo Jun¹, Gyu-rak Kim¹, and Youngson Choe^{2, †}

Department of Mechanical Engineering, Pusan National University, San 30 Jangjeon-dong, Geumjeong-gu, Busan 609-735, Republic of Korea
¹LG Electronics, 391-2 Gaeumjeong-dong, Changwon City, Gyeongnam 641-711, Republic of Korea
²Department of Chemical Engineering, Pusan National University, San 30 Jangjeon-dong, Geumjeong-gu, Busan 609-735, Republic of Korea

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The super-hydrophilic amorphous titanium dioxide (TiO2) thin film was prepared by plasma-enhanced chemical vapor deposition (PECVD) process for an application to dehumidifying finned-tube heat exchangers. The chemical components and surface structure were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD) and scanning electron microscope (SEM). The wettability and long-term durability were investigated by measuring the water contact angle and by performing wet/dry cycles. The samples were subjected to 1000 times of wet/dry cycles to establish long-term durability. The water contact angle of the amorphous TiO2 thin film was about 8° at as-deposited film with O2 plasma treatment and was about 15° after 1000 wet/dry cycles. The amorphous TiO2 thin film had excellent wettability and long-term durability under full wetting conditions.

Keywords:TiO2;PECVD;Heat exchanger;Wettability;Super-hydrophilic

[References]

Karuppuchamy S, Jeong JM, Mater. Chem. Phys., 93(2-3), 251 (2005)
Yun SM, Palanivelu K, Kim YH, Kang PH, Lee YS, J. Ind. Eng. Chem., 14(5), 667 (2008)
Maeda M, Watanabe T, Thin Solid Films, 489(1-2), 320 (2005)
Mathur S, Kuhn P, Surf. Coat. Technol., 201, 807 (2006)
Han J, Wang X, Wang N, Wei Z, Yu G, Zhou Z, Wang Q, Surf. Coat. Technol., 200, 4876 (2006)
Mane RS, Joo OS, Min SK, Lokhande CD, Han SH, Appl. Surf. Sci., 253(2), 581 (2006)
Jung C, Bae I, Song Y, Boo J, Surf. Coat. Technol., 200, 1320 (2005)
Watanabe T, Nakajima A, Wang R, Minabe M, Koizumi S, Fujishima A, Hashimoto K, Thin Solid Films, 351(1-2), 260 (1999)
Nakamura M, Akoki T, Hatanaka Y, Vacuum, 59, 506 (2000)
Sirghi L, Aoki T, Hatanaka Y, Thin Solid Films, 422(1-2), 55 (2002)
Nakamura M, Sirghi L, Aoki T, Hatanaka Y, Surf. Sci. 507-510, 778 (2002)
Miyauchi M, Kieda N, Hishita S, Mitsuhashi T, Nakajima A, Watanabe T, Hashimoto K, Surf. Sci., 511, 401 (2002)
Yasuda H, Plasma Polymerization, Academic Press, New York, NY (1985)
Kim BG, Lee SW, Ha SC, Ahn YC, Lee JK, KSME Int. J., 20, 1942 (2006)
Kim GR, Lee HU, Webb RL, Exp. Therm. Fluid Sci., 27, 1 (2002)
Wang C, Lee W, Shen W, Chang Y, Appl. Therm. Eng., 22, 267 (2002)
Min J, Webb RL, Int. J. Refrig., 25, 1054 (2002)
Min J, Webb RL, Bemisderfer CH, HVAC&R Res., 6, 257 (2000)
Koh SK, Choi SC, Han S, Cho J, Choi WK, Jung HJ, Hur HH, Key Eng. Mater., 137, 107 (1988)

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[2] Yun SM, Palanivelu K, Kim YH, Kang PH, Lee YS, J. Ind. Eng. Chem., 14(5), 667 (2008)

[3] Maeda M, Watanabe T, Thin Solid Films, 489(1-2), 320 (2005)

[4] Mathur S, Kuhn P, Surf. Coat. Technol., 201, 807 (2006)

[5] Han J, Wang X, Wang N, Wei Z, Yu G, Zhou Z, Wang Q, Surf. Coat. Technol., 200, 4876 (2006)

[6] Mane RS, Joo OS, Min SK, Lokhande CD, Han SH, Appl. Surf. Sci., 253(2), 581 (2006)

[7] Jung C, Bae I, Song Y, Boo J, Surf. Coat. Technol., 200, 1320 (2005)

[8] Watanabe T, Nakajima A, Wang R, Minabe M, Koizumi S, Fujishima A, Hashimoto K, Thin Solid Films, 351(1-2), 260 (1999)

[9] Nakamura M, Akoki T, Hatanaka Y, Vacuum, 59, 506 (2000)

[10] Sirghi L, Aoki T, Hatanaka Y, Thin Solid Films, 422(1-2), 55 (2002)

[11] Nakamura M, Sirghi L, Aoki T, Hatanaka Y, Surf. Sci. 507-510, 778 (2002)

[12] Miyauchi M, Kieda N, Hishita S, Mitsuhashi T, Nakajima A, Watanabe T, Hashimoto K, Surf. Sci., 511, 401 (2002)

[13] Yasuda H, Plasma Polymerization, Academic Press, New York, NY (1985)

[14] Kim BG, Lee SW, Ha SC, Ahn YC, Lee JK, KSME Int. J., 20, 1942 (2006)

[15] Kim GR, Lee HU, Webb RL, Exp. Therm. Fluid Sci., 27, 1 (2002)

[16] Wang C, Lee W, Shen W, Chang Y, Appl. Therm. Eng., 22, 267 (2002)

[17] Min J, Webb RL, Int. J. Refrig., 25, 1054 (2002)

[18] Min J, Webb RL, Bemisderfer CH, HVAC&R Res., 6, 257 (2000)

[19] Koh SK, Choi SC, Han S, Cho J, Choi WK, Jung HJ, Hur HH, Key Eng. Mater., 137, 107 (1988)