화학공학소재연구정보센터
Journal of Vacuum Science & Technology B, Vol.25, No.3, 853-856, 2007
Position measurement method for alignment in UV imprint using a high index mold and "electronic" moire technique
In UV imprint, positioning errors can occur between a mold and a wafer due to pressure when there is a contact with the IN resin. The moire technique, which is produced by superimposition of two gratings, is a well-known and simple method for high-resolution position measurement. However, the authors believe that a direct observation of two separate gratings is more appropriate for higher positioning accuracy. Here they propose a new method for the position measurement, which obtains "electronic" moire fringes by combining the images of two separate gratings from different areas of the mold and the wafer. The fundamental detection error was sigma = 0.15 nm. The repeatabilities of the total system was sigma = 0.68 nm in air and sigma = 0.73 nm in resin. The linearity of the measurement value to control signal was R-2 = 0.97. (c) 2007 American Vacuum Society.