Modeling and characterization of high current conduction in sub-micron titanium disilicide (TiSi2) films formed on n(+)/p(+) silicon and n(+)/p(+) polysilicon over active or field oxide under DC stress are reported. High current conduction in TiSi2 films is shown to be strongly affected by the fabrication technology acid process conditions. A model has been developed to explain the self-heating effect of silicide films under high DC stress. A parameter B is used to describe the sensitivity of the films to high current conduction. We found that the parameter B is linearly related to the initial resistance of the film, the temperature coefficient of resistance of TiSi2 and the thermal impedance of the surrounding structures, and the results agree well with the experimental data.