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Electrochemical and Solid State Letters, Vol.10, No.8, J92-J96, 2007
Process technology for high-resolution AM-PLED displays on flexible metal-foil substrates
The first successful integration of a polysilicon thin-film transistor (TFT) backplane with polymer light-emitting diodes (PLEDs) onto a flexible stainless steel foil is described, and a high-resolution (230 dots/in.) monochrome active-matrix polymer light-emitting diode (AM-PLED) display is demonstrated. The process technology required to implement this high-resolution AM-PLED display onto a flexible metal-foil substrate is discussed. This technology primarily consists of the preparation of flexible metal foil, fabrication of the active matrix polysilicon TFT backplane, and integration with top-emitting PLEDs. (c) 2007 The Electrochemical Society.