The metal photopatterning process employing a thin film of amorphous TiO2 doped with Pd2+ and oxalic acid has been developed. The exposure of this photolayer to UV light is believed to yield Pd(I) stabilized in a titanium oxide matrix, while subsequent washing results in formation of Pd nanoparticles through disproportionation. The Pd centers at the exposed areas are capable of inducing electroless nickel plating yielding the adhesive nickel pattern. The electroless copper deposition over patterned Ni allows generation of metal patterns with a resistivity of 4 - 12 mu Omega cm and a resolution of 7 mu m on the conducting substrates (indium-tin oxide glass, Si). (c) 2007 The Electrochemical Society.