This study presents a simple process to realize the lithography and deposition on a complicated three-dimensional (3D) substrate surface conformally. The 3D lithography and patterning on a highly structured surface is implemented using the self-assembled monolayer (SAM) coating and the plasma treatment. Moreover, the selective film deposition on a 3D surface and even underneath the suspended microstructures is realized using the contact displacement electroless plating. In applications, the Cu film was conformally plated and patterned on a Si substrate with 50-200 mu m deep cavities and 54.7-90 degrees sidewalls. Moreover, the Cu electrode underneath suspended microbeams was also plated. (c) 2006 The Electrochemical Society.