Several types of poly(silamine)s were prepared and their structure-characteristics relationships were investigated. When a phenyl ring in the organosilyl unit and/or a cyclic structure in the amino unit was introduced, the glass transition temperatures were increased significantly in order to increase film formability. From the thermogravimetric analysis of the poly(silamine)s, it was found that the thermal decomposition of poly(silamine)s starts at ca. 380 - 400 degrees C. On electron-beam irradiation of the poly(silamine) films, degradation of the polymer took place. On the basis of these results, poly(silamine)s can be one of the candidates for new positive-type polymeric resists.