Photolithography has been the main technology for integrated circuit (IC) fabrication during the last few decades,([1]) however its extension to the sub-100 nm range requires the development of advanced lithographic techniques, e.g., deep UV and extreme UV photolithography,([2,3]) soft X-ray lithography,([4]) electron-beam writing,([5]) and ion-beam lithography.([6]) However, the costs render these techniques less suitable for exploratory research applications, in which requirements such as pattern uniformity, reproducibility, and accurate alignment are not stringent. Complementary non-photolithographic techniques, including soft lithography,([7]) nanoimprint lithography (NIL),([8]) and capillary force lithography (CFL)([9]) have been developed successfully during the last decade in the field of micro- and nanofabrication.