The surface morphology and electrical resistance of the contacts on semiconductor devices are strongly influenced by metallization scheme and annealing conditions. In this work is presented an investigation of Ohmic contacts formed by metal-semiconductor alloying on epitaxial GaN/ AlGaN heterostructures. After the deposition of metallic multi-layers (Ti, Al, An and Pt), the process of rapid thermal annealing was carried out in nitrogen, argon and forming gas atmosphere. A series of the samples with different sequences of metallic layers and diverse thicknesses was prepared by employing electron beam evaporation and lift-off deposition techniques. The chemical composition of the samples before and after annealing was studied by means of X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) techniques combined with low energy Ar+ ion sputtering. The sputtering has been carried out in two different modes: by using constant (square) or gradually narrowed sputtered area. The changes in the chemical state of constituent elements and compositional profiles of the contacts after thermal annealing were revealed from the obtained results. Among the technological problems, influencing on the quality of the contact, were found to be the oxidation and nitridation of the contact surface during thermal annealing, as well as the intermediate sub-layers of Al and Ti oxides, formed during the deposition of metallic multi-layered structure. (c) 2006 Elsevier B.V. All rights reserved.