The adhesion of Cu on Ru substrates with different crystal orientations was evaluated. The crystal orientation of sputter deposited Ru could be changed from (100) to (001) by annealing at 650 degrees C for 20 min. The adhesion of Cu was evaluated by the degree of Cu agglomeration on Ru. Cu films on annealed Ru films with the (001) crystal orientation showed 28% lower RMS values and 50% lower Ru surface coverage than Cu as-deposited on Ru having the (100) crystal orientation after annealing at 550 degrees C for 30 min, which suggest that Cu wettability on the Ru(001) was better than that on the Ru(100) plane. The low lattice misfit of 4% between Cu(111) and Ru(001) may be the reason for this good adhesion 0 property. (c) 2005 Elsevier B.V. All rights reserved.