A new process for microelectromechanical systems (MEMS) has been developed and employed in the microfabrication of inductive actuators. The process combines deep UV lithography and metal electroplating with bulk silicon micromachining. The lithography is based on an AZ-4260 photoresist with a thickness of 50 mum, while electroplating is accomplished by using a gold bath; the bulk silicon is micromachined in an aqueous KOH solution (28% w/w) at 80 degreesC. This process has been successfully applied in the micromachining of an oscillating mirror actuated by induction. The results show compatibility between the microfabrication process of the metallic structures and the KOH bulk silicon micromachining process. The photoresist mold remained intact after the electroplating step, and the electroplated structures were uniform in thickness, surface uniformly smooth, and presented good adhesion, maintaining these features also after KOH micromachining. (C) 2003 Elsevier Science B.V. All rights reserved.