In this work, a short review is presented for results utilizing the technique of laser-assisted metallization of dielectrics. Experimental efforts and results related to the metal (palladium (Pd). copper (Cu) and silver (Ag)) deposition on polymeric materials (polyimide (PI), mylar) are reported. These polymers and metals are chosen due to their growing importance in the rapidly-developing microelectronics packaging industry. The method of laser-induced chemical liquid-phase deposition (LCLD) offers many advantages compared to other techniques such as laser-induced forward transfer (LIFT), pulsed-laser deposition (PLD) and laser-assisted chemical vapor-phase deposition (LCVD). The LCLD is time and cost effective because vacuum tools and special pre-treatments are not required. The consumed chemicals used in precursors are non-harmful and easy to handle due to the liquid phase. For the optimal physical and chemical properties of deposits, the laser and solution parameters are varied. XeCl and KrF excimer and Ar+ lasers are employed for executing the palladium. Ag and/or Cu formation on the polymer substrates. Chemical and physical analyses of the formed metal patterns are performed by EDX, XRD, FESEM, SEM, resistance and adhesion measurements.