Unsymmetrical dimethyl hydrazine (UDMH) (CH3)(2)N-2 is often used in the deposition of dilute nitride semiconductors because it provides a source of nitrogen with a low thermal decomposition temperature (Temperature-dependent carrier lifetime in GaNAs using resonant-coupled photoconductive decay, NCPV Program Review Meeting, Lakewood, Colorado, 14-17 October, 2001). The problems with using this material, however, are its significant toxicity (0.01 ppm compared to ammonia's 25 ppm) and also the fact that it blocks the action of conventional dosed wet scrubbers sometimes used on nitride applications, resulting in diminished efficiency in removing arsine (the source of arsenic), and arsine being similarly toxic (TLV of 0.05 ppm). Efficient removal of UDMH, AsH3 and hydrogen (which, though not toxic poses a potential safety hazard) by means of a combined thermal oxidation reaction and wet scrubber in series is described at input gas flow rates exceeding those typically encountered in practice. The detection technique employed was Fourier transform infra red spectroscopy (FTIR), and the calibration and resolution techniques will be described. For input UDMH flows of up to 445 sccm (i.e. 1.85 x 10(-2) mol/min), destructive reaction efficiencies (DREs) of >99.9% were demonstrated, corresponding to the background detection resolution of 0.4 ppm. (C) 2004 Elsevier B.V. All rights reserved.