Camber and stress development during the cofiring of a bilayer low-temperature-cofired glass dielectric laminate, composed of a crystallizable glass (CG) and ceramic-filled glass (CFG), have been investigated. The sintering mismatch stress is calculated from the camber development during cofiring and found to be less than those of sintering potentials. This explains the absence of defects, such as de-densification, de-bonding, and channel cracks in the coifed multilayer CG/CFG laminates. Reasonably good agreement is found between the sintering mismatch stress obtained from the camber rate data and that calculated using the linear strain rate difference from the dilatometric data.